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Zalman STC9 Thermal Paste Compound 4g by Zalman


Zalman STC9 Thermal Paste Compound 4g Image

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Key Features

  • Highly efficient thermal compound paste in 4g syringe
  • Easy to use and easy to apply
  • Suitable for cooling fans, CPUs and other computer components
  • Density: 2.7 g/cm³
  • Thermal conductivity: 9.1 W/m·K
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Details

Highly effective thermal conductivity allows heat from CPU or any computer chips to cool down and very safe as there is no electrical conductivity. Scale markings on the syringe allow accurate and visual measurement of the content while using or reusing the product. Syringe-type is easy to use and rubber-cap prevents liquid content from being hardened over a period of time when reused.

Specifications
WEIGHT / VOLUME 4g
THERMAL CONDUCTIVITY 9.1 W/m·K
COLOR Grey
DENSITY 2.7 g/cm³
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