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Zalman STC7 Thermal Paste Compound 4g by Zalman


Zalman STC7 Thermal Paste Compound 4g Image

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Key Features

  • 4g thermal paste, in easy-to-apply syringe
  • Excellent thermal conductivity
  • Micro-filler density
  • Easy to use, apply and store
  • Great cooling option for CPUs, graphics processors and more
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Details

The STC 7 thermal conductivity allows heat from CPU or any computer chips to cool down and is very safe as there is no electrical conductivity. Scale marking on the syringe allows accurate and visual measurement of the content while using or reusing the product. Particle size technology provides optimal filler density to conveniently use on any type of computer chips. 220 Pa.s.
Syringe style is easy to use and rubber-cap prevents liquid content from being hardened over a period of time if reusing is needed
Fine micro particles fill up space between the heatsink and CPU to maximize cooling performance & RoHS Certified.

Specifications
WEIGHT / VOLUME 4g
THERMAL CONDUCTIVITY 7.2 W/m·K
COLOR Grey
DENSITY 2.6 g/cm³
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