Antec Formula 6 Nano Diamond Thermal Paste by Antec
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- Item Number: 274-0001
- Part Number: FORMULA6
No longer available. See alternative options
Key Features
- Formula 6 Thermal Paste
- 4g easy-to-apply syringe
- Thermal conductivity of 5.3 W/m·K
- Antec is a premium manufacturer of cooling products
See product description
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Details
Antec’s Formula 6 thermal compound protects your CPU even when your rig is running on all cylinders. Since little of the CPU’s surface actually touches the heat sink, you need a solution that isolates and facilitates the transfer of heat. Formula 6’s nano diamond particles minimize the distance between heat-conductive compounds and gladly take on the highest demanding CPU, optimally performing between -30°C and 250°C. To keep your system cool and your CPU functioning comfortably, pick up Antec’s Formula 6 for a diamond-caliber solution.
Specifications
| WEIGHT / VOLUME | 4g |
| THERMAL CONDUCTIVITY | 5.3 W/m·K |
| OPERATING TEMPERATURE | -30 - 250 °C |