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Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K by Cooler Master


Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K Image

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Key Features

  • Suitable for CPU, chipsets on Mainboard, VGA card, etc
  • Easy to use
  • Zif Socket Templates ensure correct applying area with various CPU socket types
  • Produces an even layer when using applicator
  • Dielectric
  • Wide range of application temperature
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Details
Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177oC (350oF), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.
Specifications
THERMAL CONDUCTIVITY 4.5 W/m·K
COLOR White
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