256MB Transcend PC100 SO-DIMM laptop memory module CL2 by Transcend
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- Item Number: 10204
- Part Number: TS32MSS64V8L2
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Key Features
- 256MB PC100 laptop memory
- SO-DIMM 100MHz
- Transcend laptop memory module
- CL2, 144 pins, non-ECC, 3.3V
- Low-density chips, 16 chips per module
See product description
Details
256MB Transcend SO-DIMM PC100 (100MHz) laptop memory module. CL2 timings, 144 pins, non-ECC, 3.3V. This memory module has 16 low-density 16Mx8 chips, making it compatible with most older laptops designed for PC100 memory.
The TS32MSS64V8L2 is a 32M bit x 64 Synchronous Dynamic RAM high density memory module. TS32MSS64V8L2 consists of 16 pieces of CMOS 16Mx8bits Synchronous DRAMs in WBGA packages and a 2048 bits serial EEPROM on a 144-pin printed circuit board.
The TS32MSS64V8L2 is a Dual In-Line Memory Module and is intended for mounting into 144-pin edge connector sockets.
Synchronous design allows precise cycle control with the use of system clock. I/O transactions are possible on every clock cycle. Range of operation frequencies, programmable latencies allows the same device to be useful for a variety of high bandwidth, high performance memory system
applications.
The TS32MSS64V8L2 is a 32M bit x 64 Synchronous Dynamic RAM high density memory module. TS32MSS64V8L2 consists of 16 pieces of CMOS 16Mx8bits Synchronous DRAMs in WBGA packages and a 2048 bits serial EEPROM on a 144-pin printed circuit board.
The TS32MSS64V8L2 is a Dual In-Line Memory Module and is intended for mounting into 144-pin edge connector sockets.
Synchronous design allows precise cycle control with the use of system clock. I/O transactions are possible on every clock cycle. Range of operation frequencies, programmable latencies allows the same device to be useful for a variety of high bandwidth, high performance memory system
applications.
Specifications
| TYPE | SO-DIMM laptop memory |
| CAPACITY | 256MB |
| STANDARD | PC100 |
| MEMORY SPEED | 100MHz |
| CAS LATENCY | CL2 |
| VOLTAGE | 3.3V |
| FORM FACTOR | 144-pin SO-DIMM SDRAM |
| CONFIGURATION | Double-sided module, 16 chips per module, 8 chips per side |
| FEATURES | 6-layer PCB Low-density chips for best compatibility |
| PACKAGING | Retail packaging |
| WARRANTY | Lifetime manufacturers warranty |