Noctua NT-H1 heat sink compound Thermal paste 3.5 g by Noctua
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- Item Number: FD3054364
- Part Number: NT-H1 3.5g SW Edition
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Expected to ship within 11 days of order Shipping to United Kingdom only € 4.99! |
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Details
SW (Spatula & Wipes) Edition
The SW (Spatula & Wipes) Edition includes a spatula for users who prefer to manually spread the paste before installing the heatsink as well as three NA-CW1 cleaning wipes for pre-application cleaning and easy removal.
Not electrically conductive, non-corroding
While some high-end thermal compounds and pads are risky to use due to their electrical conductivity or corroding properties, there’s no risk of short-circuits with NT-H1 and it’s completely safe to use with any type of CPU cooler, regardless of whether it’s made from copper or aluminium and whether it’s nickel-plated or not.
Excellent long-term stability
NT-H1's unique formula is highly stable over time, even after longer periods of usage. It can be stored at room temperature for at least 3 years and due to the compound’s exceptional curing, bleeding, dry-out and thermal cycling characteristics, it can be used on the CPU for 5 years or more.
No break-in or burn-in required
Some thermal compounds need a longer break-in period or cure time until they reach their full performance and some thermal pads must undergo a dedicated burn-in process. By contrast, NT-H1 is ready to go right away and doesn’t require any special preparations.
The SW (Spatula & Wipes) Edition includes a spatula for users who prefer to manually spread the paste before installing the heatsink as well as three NA-CW1 cleaning wipes for pre-application cleaning and easy removal.
Not electrically conductive, non-corroding
While some high-end thermal compounds and pads are risky to use due to their electrical conductivity or corroding properties, there’s no risk of short-circuits with NT-H1 and it’s completely safe to use with any type of CPU cooler, regardless of whether it’s made from copper or aluminium and whether it’s nickel-plated or not.
Excellent long-term stability
NT-H1's unique formula is highly stable over time, even after longer periods of usage. It can be stored at room temperature for at least 3 years and due to the compound’s exceptional curing, bleeding, dry-out and thermal cycling characteristics, it can be used on the CPU for 5 years or more.
No break-in or burn-in required
Some thermal compounds need a longer break-in period or cure time until they reach their full performance and some thermal pads must undergo a dedicated burn-in process. By contrast, NT-H1 is ready to go right away and doesn’t require any special preparations.
Specifications
| WEIGHT / VOLUME | 3.5 g |
| OPERATING TEMPERATURE | -50 - 110 °C |
| COLOR | Grey |
| DENSITY | 2.49 g/cm³ |